SJ 21455-2018 Active Industry standards-Electronics

SJ 21455-2018 Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering

SJ 21455-2018 Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: SJ 21455-2018
Standard Type: Industry standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: -
Publish Date: 2018-01-18
Implement Date: 2018-05-01
Pages: 13 pages

Scope

This standard specifies the general and detailed requirements for the sintering and sealing process of integrated circuit ceramic packages (hereinafter referred to as the alloy sintering sealing process). This standard applies to the alloy sintering sealing process between metal, ceramic, and glass cover plates and ceramic shells with alloy solder

Development Information

Pages: 13 pages

Referenced Standards

Related Standards

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