DZ/T 0101.12-1994
Active
SJ 21455-2018
Active
Industry standards-Electronics
SJ 21455-2018 Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering
SJ 21455-2018 Integrated circuit ceramic package-Technical requirements for sealing process with alloy-sintering
Price:
$ 30
Basic Information
Standard Code:
SJ 21455-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
13 pages
Scope
This standard specifies the general and detailed requirements for the sintering and sealing process of integrated circuit ceramic packages (hereinafter referred to as the alloy sintering sealing process). This standard applies to the alloy sintering sealing process between metal, ceramic, and glass cover plates and ceramic shells with alloy solder
Development Information
Referenced Standards
GB/T 25915.1-2010 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness
GJB 1420B-2011
GJB 2438
GJB 3007
GJB 548B-2005
GJB 597
YB/T 5231-2014 Fixed expansion welding of iron-nickel-cobalt alloy
YB/T 5231-2005 Sealed iron-cobalt alloy with permanent expansion
YB/T 5235
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