GB/T 17473.7-2008 Replaced National standards

GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance

GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics—Determination of solderability and solderelaching resistance

Publish Date: 2008-03-31 Implement Date: 2008-09-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 17473.7-2008

Standard Type: National standards

Standard Status: Replaced

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metals and their alloys

Publish Date: 2008-03-31

Implement Date: 2008-09-01

Pages: 4 pages

Scope

This standard specifies the solderability and solder resistance determination methods for precious metal solder paste used in microelectronics technology. This standard is applicable to the determination of the solderability and solder resistance of precious metal solder paste used in microelectronics technology.

Development Information

Word Count: 6 Thousand words Pages: 4 pages

Same series standard

GB/T 17473.1-2008 Test methods of precious metals pastes used for microelectronics—Determination of solids content GB/T 17473.2-2008 Test methods of precious metals pastes used for microelectronics—Determination of fineness GB/T 17473.3-2008 Test methods of precious metals pastes used for microelectronics—Determination of sheet resistance GB/T 17473.4-2008 Test methods of precious metals pastes used for microelectronics—Determination of adhesion GB/T 17473.5-2008 Test methods of precious metals pastes used for microelectronics—Determination of viscosity GB/T 17473.6-2008 Test methods of precious metals pastes used for microelectronics—Determination of resolution

Replace the following standards

GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics—Test of solderability and solderleaching resistance

Superseded by the following standards

GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance

Related Standards

GB/T 13840-1992 Abolished

GB/T 13840-1992 Wafer carriers

Publish Date: 1992-12-28

GB/T 15677-1995 Replaced

GB/T 15677-1995 Lanthanum metal

Publish Date: 1995-08-11

GB/T 3136-1995 abolished_transferred

GB/T 3136-1995 Tantalum powders

Publish Date: 1995-10-17

GB/T 3463-1995 Abolished

GB/T 3463-1995 Tantalum wires

Publish Date: 1995-10-17

GB/T 3628-1995 Replaced

GB/T 3628-1995 Tantalum and tantalum alloy foils

Publish Date: 1995-10-17

GB/T 16476-1996 Replaced

GB/T 16476-1996 Scandium metal

Publish Date: 1996-07-09