GB/T 4855-1984
Abolished
GB/T 32816-2016
Active
National standards
GB/T 32816-2016 Silicon-based MEMS fabrication technology—Specification for criterion of the combinationof the deep etching and bonding process
GB/T 32816-2016 Silicon-based MEMS fabrication technology—Specification for criterion of the combinationof the deep etching and bonding process
Basic Information
Standard Code:
GB/T 32816-2016
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2016-08-29
Implement Date:
2017-03-01
Pages:
17 pages
Scope
This standard specifies the process requirements and quality inspection requirements that should be followed when processing MEMS devices using a process integration centered on deep etching and bonding. This standard is applicable to the processing and quality inspection based on a process integration centered on deep etching and bonding.
Development Information
Referenced Standards
GB/T 19022-2003 Measurement management systems—Requirements for measurement processes and measuring equipment
GB/T 19022.2-2000 Quality assurance for measuring equipment—Part 2:Guidelines for control of measurement processes
GB/T 26111-2010 Micro-electromechanical system technology—Terms
GB/T 26111-2023 Micro-electromechanical system technology—Terms
GB 50073-2013 Code for design of clean room
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished