GB/T 14293-1998
Active
T/ZJL 0025-2024
Active
Group standards
T/ZJL 0025-2024 Automatic production equipment for diamond electroplating with sawing line for semiconductor wafers
T/ZJL 0025-2024 Automatic production equipment for diamond electroplating with sawing line for semiconductor wafers
Price:
$ 20.00
Basic Information
Standard Code:
T/ZJL 0025-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Surface treatment and plating coating combined
Publish Date:
2024-12-26
Implement Date:
2025-01-20
Scope
Main technical content: This document specifies the model specifications, structure and basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage and installation of automated production equipment for sawing and electroplating diamond on semiconductor wafer rods. This document is applicable to the production and manufacture of automated production equipment for sawing and electroplating diamond on semiconductor wafer rods with a baseline line diameter not exceeding 0.210 mm.
Development Information
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