GB/T 41852-2022 Semiconductor devices-Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Scope

This document specifies a test method for measuring the bonding strength between micro-sized units and substrates using columnar specimens. This document is applicable to bonding strength testing of microstructures on substrates with widths and thicknesses ranging from 1 μm to 1 mm. The micro-sized units of MEMS devices are composed of stacked fine film patterns fabricated on substrates through processes such as deposition, electroplating, and photolithography. MEMS devices contain numerous interfaces between different materials, which may occasionally delaminate during manufacturing or use. The bonding strength at the interface of the connected materials determines the bonding strength. In addition, defects and residual stress near the interface can vary with process conditions, greatly affecting the bonding strength. This document specifies a test method for bonding strength of micro-sized units to facilitate the selection of materials and process conditions for MEMS devices. Due to the wide range of materials and sizes used in MEMS devices, and the fact that instruments for measuring micro-sized units have not been widely promoted, this document does not impose specific restrictions on the material, size, or performance of the specimens.

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