GB/T 4298-1984
Abolished
GB/T 32817-2016
Active
National standards
GB/T 32817-2016 Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
GB/T 32817-2016 Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
Basic Information
Standard Code:
GB/T 32817-2016
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Other discrete semiconductor devices
Publish Date:
2016-08-29
Implement Date:
2017-03-01
Pages:
19 pages
Scope
This standard describes the general specifications for microelectromechanical systems (MEMS) manufactured using semiconductors, sets forth the general procedures for quality assessment in the IECQ CECC system, and provides guidelines for the description and testing of electrical, optical, mechanical, and environmental characteristics. This standard applies to all types of MEMS devices, such as sensors and radio frequency MEMS, but excludes optical MEMS, biological MEMS, micro total analysis systems (MicroTAS), and micro energy MEMS.
Development Information
Referenced Standards
GB/T 2423.55-2023 Environmental testing—Part 2:Test methods—Test Eh:Hammer tests
GB/T 2423.56-2006 Environmental testing for electric and electronic products—Part 2:Test methods—Test Fh:Vibration, broad-band random(digital control)and guidance
GB/T 2423.56-2018 Environmental testing—Part 2:Test methods—Test Fh:Vibration, broadband random and guidance
GB/T 2423.56-2023 Environmental testing—Part 2:Test methods—Test Fh:Vibration,broadband random and guidance
GB/T 2423.57-2008 Environmental testing for electric and electronic products—Part 2:Tests—Test Ei:Shock—Shock response spectrum synthesis
GB/T 2423.58-2008 Environmental testing for electric and electronic products—Part 2:Tests methods—Test Fi:Vibration—Mixed Mode
GB/T 2423.59-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test Z/ABMFh:Combined temperature(cold and heat)/low air pressure/vibration(random)
GB/T 2423.60-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test U:Robustness of terminations and integral mounting devices
GB/T 2423.61-2018 Environmental testing—Part 2:Test methods—Test and guidance:Dust and sand test for large specimen
GB/T 2423.62-2018 Environmental testing—Part 2:Test motheds—Test Fx and guidance:Mulit input mulit output vibration test
GB/T 2423.63-2019 Environmental testing—Part 2:Test methods—Test:combined temperature(cold and heat)/low air pressure/vibration(mixed mode)
GB/T 2423.64-2023 Environmental testing—Part 2:Test methods—Test Fj:Vibration—Long time history replication
GB/T 2423.65-2024 Environmental testing—Part 2:Test methods—Test:Combined salt mist/temperature/humidity/solar radiation
GB/T 2423.66-2025 Environmental testing—Part 2:Test methods—Test:Combined temperature/humidity/static load
GB/T 2423.101-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test:Inclinations and swings
GB/T 2423.101-2025 Environmental testing—Part 2:Test methods—Test:Inclinations and swings
GB/T 2423.102-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test: combined temperature(cold and heat)/low air pressure/vibration(sinusoidal)
GB/T 2424.1-2005 Environmental testing for electric and electronic products—Guidance for high temperature and low temperature tests
GB/T 2424.1-2015 Environmental testing—Part 3:Supporting documentation and guidance—Cold and dry heat tests
GB/T 2424.2-1993 Basic environmental testing procedures for electric and electronic products Guidance for damp heat tests
GB/T 2424.2-2005 Environment tests for electric and electronic products—Guidance for damp heat tests
GB/T 2424.5-2006 Environmental tests for electric and electronic products—Confirmation of the performance of temperature chambers
GB/T 2424.5-2021 Environmental testing—Part 3:Supporting documentation and guidance—Confirmation of the performance of temperature chambers
GB/T 2424.6-2006 Environmental testing for electric and electronic products—Confirmation of the performance of temperature/humidity chambers
GB/T 2424.6-2021 Environmental testing—Part 3: Supporting documentation and guidance—Confirmation of the performance of temperature/humidity chambers
GB/T 2424.7-2006 Environmental tests for electric and electronic products—Measurements in temperature chambers for tests A and tests B (with load)
GB/T 2424.7-2024 Environmental testing—Part 3:Supporting documentation and guidance—Meas-urements in temperature chambers for tests A(Cold)and B(Dry heat)(with load)
GB/T 2424.10-1993 Basic environmental testing procedures for electric and electronic products—General guidance of accelerated testing for atmospheric corrosion
GB/T 2424.10-2012 Environmental testing—General guidance of accelerated testing for atmospheric corrosion
GB/T 2424.11-2013 Environmental testing—Part 2:Test methods—Guidance to test Kc:Sulphur dioxide test for contacts and connections
GB/T 2424.12-2014 Environmental testing—Part 2:Test methods—Guidance to test Kd:Hydrogen sulphide test for contacts and connections
GB/T 2424.13-2002 Environmental testing for electric and electronic products—Part 2:Test methods—Guidance on change of temperature tests
GB/T 2424.14-1995 Environmental testing for electric and electronic products—Part 2:Test methods—Guidance for solar radiation testing
GB/T 2424.15-1992 Basic enviromental testing procedures for electric and electronic products Guide for combined temperature/low air pressure tests
GB/T 2424.15-2008 Environmental testing for electric and electronic products—Guide for combined temperature/low air pressure tests
GB/T 2424.17-1995 Environmental testing for electric and electronic products—Guidance on soldering test
GB/T 2424.17-2008 Environmental testing for electric and electronic products—Part 2:Tests methods Guidance on test T:Soldering test
GB/T 2424.19-2005 Environment tests for electric and electronic products—Guidance on the application of the environmental test to simulate the effects of storage
GB/T 2424.22-1986 Basic environmental testing procedures for electric and electronic products Guidance for combined temperature (cold and heat) vibration (sinusoidal) tests
GB/T 2424.23-1990 Basic environmental test procedures for electric and electronic products Guidance for water test
GB/T 2424.24-1995 Basic environmental testing procedures for electric and electronic products Guidance for combined temperature(cold and heat)/low air pressure/vibration (sinusoidal)test
GB/T 2424.25-2000 Environmental testing for electric and electronic products—Part 3:Test guidance-Seismic test methods
GB/T 2424.25-2024 Environmental testing—Part 3:Test guidance—Seismic test methods
GB/T 2424.26-2008 Environmental testing for electric and electronic products—Part 3:Supporting documentation and guidance—Selecting amongst vibration tests
GB/T 2424.27-2013 Environmental testing—Supporting documentation and guidance—Calculation of uncertainty of conditions in climatic test chambers
GB/T 2828.1-2003 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection
GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection
GB 3100-1993 SI units and recommendations for the use of their multiples and of certain other units
GB/T 4728.1-2005 Graphical symbols for electrical diagrams—Part 1:General information
GB/T 4728.1-2018 Graphical symbols for electrical diagrams—Part 1:General information
GB/T 4728.2-1998 Graphical symbols for diagrams—Part 2 Symbol elements,qualifying symbols and other symbols having general application
GB/T 4728.2-2005 Graphical symbols for electrical diagrams—Part 2:Symbol elements,qualifying symbols and other symbols having general application
GB/T 4728.2-2018 Graphical symbols for electrical diagrams—Part 2:Symbol elements,qualifying symbols and other symbols having general application
GB/T 4728.3-1998 Graphical symbols for diagrams—Part 3 Conductors and connecting devices
GB/T 4728.3-2005 Graphical symbols for electrical diagrams—Part 3:Conductors and connecting devices
GB/T 4728.3-2018 Graphical symbols for electrical diagrams—Part 3:Conductors and connecting devices
GB/T 4728.4-1999 Graphical symbols for diagrams—Part 4:Basic passive components
GB/T 4728.4-2005 Graphical symbols for electrical diagrams—Part 4:Basic passive components
GB/T 4728.4-2018 Graphical symbols for electrical diagrams—Part 4:Basic passive components
GB/T 4728.5-2000 Graphical symbols for diagrams—Part 5:Semiconductors and electron tubes
GB/T 4728.5-2005 Graphical symbols for electrical diagrams—Part 5:Semiconductors and electron tubes
GB/T 4728.5-2018 Graphical symbols for electrical diagrams—Part 5:Semiconductors and electron tubes
GB/T 4728.6-2000 Graphical symbols for diagrams—Part 6:Production and conversion of electrical energy
GB/T 4728.6-2008 Graphical symbols for diagrams—Part 6:Production and conversion of electrical energy
GB/T 4728.6-2022 Graphical symbols for electrical diagrams—Part 6:Production and conversion of electrical energy
GB/T 4728.7-2000 Graphical symbols for diagrams—Part 7:Switchgear,controlgear and protective devices
GB/T 4728.7-2008 Graphical symbols for diagrams—Part 7:Switchgear,controlgear and protective devices
GB/T 4728.7-2022 Graphical symbols for electrical diagrams—Part 7:Switchgear,controlgear and protective devices
GB/T 4728.8-2000 Graphical symbols for diagrams—Part 8:Measuring instruments,lamps and signalling devices
GB/T 4728.8-2008 Graphical symbols for diagrams—Part 8:Measuring instruments,lamps and signaling devices
GB/T 4728.8-2022 Graphical symbols for electrical diagrams—Part 8:Measuring instruments,lamps and signalling devices
GB/T 4728.9-1999 Graphical symbols for diagrams—Part 9:Telecommunications:Switching and peripheral equipment
GB/T 4728.9-2008 Graphical symbols for diagrams—Part 9:Telecommunications:Switching and peripheral equipment
GB/T 4728.9-2022 Graphical symbols for electrical diagrams—Part 9:Telecommunications:Switching and peripheral equipment
GB/T 4728.10-1999 Graphical symbols for diagrams—Part 10:Telecommunications:Transmission
GB/T 4728.10-2008 Graphical symbols for diagrams—Part 10:Telecommunications:Transmission
GB/T 4728.10-2022 Graphical symbols for electrical diagrams—Part 10:Telecommunications:Transmission
GB/T 4728.11-2000 Graphical symbols for diagrams—Part 11:Architectural and topographical installation plans and diagrams
GB/T 4728.11-2008 Graphical symbols for diagrams—Part 11:Architectural and topographical installation plans and diagrams
GB/T 4728.11-2022 Graphical symbols for electrical diagrams—Part 11:Architectural and topographical
GB/T 4728.12-1996 Graphical symbols for electrical diagrams—Part 12:Binary logic elements
GB/T 4728.12-2008 Graphical symbols for diagrams—Part 12:Binary logic elements
GB/T 4728.12-2022 Graphical symbols for electrical diagrams—Part 12:Binary logic elements
GB/T 4728.13-1996 Graphical symbols for electrical diagrams Part 13:Analogue elements
GB/T 4728.13-2008 Graphical symbols for diagrams—Part 13:Analogue elements
GB/T 4728.13-2022 Graphical symbols for electrical diagrams—Part 13:Analogue elements
GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 4937.1-2006 Semiconductor devices—Mechanical and climatic test methods—Part 1:General
GB/T 4937.2-2006 Semiconductor devices—Mechanical and climatic test methods—Part 2:Low air pressure
GB/T 4937.3-2012 Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination
GB/T 4937.4-2012 Semiconductor devices—Mechanical and climatic test methods—Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 4937.8-2025 Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing
GB/T 4937.9-2026 Semiconductor devices—Mechanical and climatic test methods—Part 9:Permanence of marking
GB/T 4937.10-2025 Semiconductor devices—Mechanical and climatic tests methods—Part 10:Mechanical Shock—Device and subassembly
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity)
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND)
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose)
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.24-2025 Semiconductor devices—Mechanical and climatic test methods—Part 24:Accelerated moisture resistance—Unbiased HAST
GB/T 4937.25-2025 Semiconductor devices—Mechanical and climatic test methods—Part 25:Temperature cycling
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climate test methods—Part 26:Electrostatic discharge(ESD)sensitivity testing—Human body model(HBM)
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27:Electrostatic discharge (ESD) sensitivity testing—Machine model (MM)
GB/T 4937.28-2026 Semiconductor devices—Mechanical and climate test methods—Part 28:Electrostatic discharge(ESD)sensitivity testing—Charged device model(CDM)—device level
GB/T 4937.29-2025 Semiconductor devices—Mechanical and climatic test methods—Part 29:Latch-up test
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices(internally induced)
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced)
GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33:Accelerated moisture resistance—Unbiased autoclave
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34: Power cycling
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components
GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state
GB/T 4937.37-2025 Semiconductor devices—Mechanical and climatic test methods—Part 37:Board level drop test method using an accelerometer
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38:Soft error test method for semiconductor devices with memory
GB/T 4937.39-2025 Semiconductor devices—Mechanical and climatic test methods—Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
GB/T 4937.40-2025 Semiconductor devices—Mechanical and climatic test methods—Part 40:Board level drop test method using a strain gauge
GB/T 4937.41-2026 Semiconductor devices—Mechanical and climatic test methods—Part 41:Test method for reliability of non-volatile memory devices
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44:Neutron beam irradiated single event effect(SEE) test method for semiconductor devices
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
GB/T 26111-2010 Micro-electromechanical system technology—Terms
GB/T 26111-2023 Micro-electromechanical system technology—Terms
IEC 60027(所有部分)
IEC 60747-1:2006
IEC 61193-2
IECQ 03-3:2013
Adopt standards
IEC 62047-4:2008
Related Standards
GB/T 15449-1995
Active
GB/T 15449-1995 Blank detail-specification for field-effect transistors for case-rated swatching application
GB/T 15450-1995
Abolished
GB/T 15450-1995 Blank detail specification for silicon dual-gate field-effect transistors
GB/T 15529-1995
Active
GB/T 15529-1995 Blank detail specification for LED numeric displays
GB/T 41852-2022
Active
GB/T 41852-2022 Semiconductor devices-Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
GB/T 41853-2022
Active