GB/T 1954-1980
Replaced
T/CWAN 0005-2021
Active
Group standards
T/CWAN 0005-2021 Recommended process specifications for soldering of lead-free brazing materials used in rectifier devices
T/CWAN 0005-2021 Recommended process specifications for soldering of lead-free brazing materials used in rectifier devices
Price:
$ 21.00
Basic Information
Standard Code:
T/CWAN 0005-2021
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Welding and cutting
ICS Name:
\nWelding joints
Publish Date:
2021-06-10
Implement Date:
2021-08-01
Pages:
12 pages
Scope
This document specifies the recommended reflow soldering process for lead-free solder used in rectifier devices.
This document is applicable to reflow soldering of copper metal with a thickness of ≤0.8 mm.
Development Information
Referenced Standards
Related Standards
GB/T 4675.1-1984
Abolished
GB/T 4675.1-1984 Weld ability testing Method of Y-groove cracking test
GB/T 4675.2-1984
Abolished
GB/T 4675.2-1984 Weld ability testing Method of controlled thermal severity cracking test
GB/T 4675.3-1984
Abolished
GB/T 4675.3-1984 Weld ability testing Method of cracking test for welded tee joint
GB/T 4675.4-1984
Abolished
GB/T 4675.4-1984 Weld ability testing Method of FISCO cracking test
GB/T 4675.5-1984
Abolished