GB/T 4855-1984
Abolished
T/JSSIA 0002-2017
Active
Group standards
T/JSSIA 0002-2017 Fan-out chip scale package (FO-CSP) footprint。
T/JSSIA 0002-2017 Fan-out chip scale package (FO-CSP) footprint。
Price:
$ 20.00
Basic Information
Standard Code:
T/JSSIA 0002-2017
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2017-09-29
Implement Date:
2017-10-01
Scope
Scope: This standard specifies the external dimensions of flip-chip ball grid array (FCBGA) packages, which are applicable to the inspection of finished dimensions and packaging design of flip-chip ball grid array (FCBGA) packages. Main technical content: It specifies the external dimensions of flip-chip ball grid array (FCBGA) packages, which are applicable to the inspection of finished dimensions and packaging design of flip-chip ball grid array (FCBGA) packages.
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished