GB/T 4855-1984
Abolished
T/CIET 766-2024
Active
Group standards
T/CIET 766-2024 Diamond composite heat dissipation material chip heat sink technical requirements
T/CIET 766-2024 Diamond composite heat dissipation material chip heat sink technical requirements
Price:
$ 20.00
Basic Information
Standard Code:
T/CIET 766-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2024-11-06
Implement Date:
2024-11-06
Scope
Scope: This document specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of diamond composite heat sinks for chips. This document is applicable to the development, production, inspection, and acceptance of diamond composite heat sinks for chips. Main technical content: This document specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of diamond composite heat sinks for chips. This document is applicable to the development, production, inspection, and acceptance of diamond composite heat sinks for chips.
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished