GB/T 4855-1984
Abolished
T/JSSIA 0006-2021
Active
Group standards
T/JSSIA 0006-2021 Wafer-level fan-out packaging outline dimensions
T/JSSIA 0006-2021 Wafer-level fan-out packaging outline dimensions
Price:
$ 20.00
Basic Information
Standard Code:
T/JSSIA 0006-2021
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Communication equipment
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2021-11-10
Implement Date:
2021-11-15
Scope
Scope: This document specifies the physical dimensions of the wafer-level fan-out packaging (FOWLP). This document is applicable to the finished design and dimensional inspection of wafer-level fan-out packaging (FOWLP); Main technical content: This document specifies the physical dimensions of the wafer-level fan-out packaging (FOWLP). This document is applicable to the finished design and dimensional inspection of wafer-level fan-out packaging (FOWLP).
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished