GB/T 4855-1984
Abolished
T/JSSIA 0001-2024
Active
Group standards
T/JSSIA 0001-2024 Evaluation method for interface bonding force between photoconductive medium thin film and interconnect metal interface
T/JSSIA 0001-2024 Evaluation method for interface bonding force between photoconductive medium thin film and interconnect metal interface
Price:
$ 20.00
Basic Information
Standard Code:
T/JSSIA 0001-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2024-06-05
Implement Date:
2024-06-10
Pages:
10 pages
Scope
Scope: Applicable to wafer/board-level fan-out packaging, the evaluation of the bonding strength between photosensitive dielectric films and interconnect metals in wafer-level packaging, and the interface between photosensitive films and film materials; Main technical content: This document specifies the test methods for the bonding strength between photosensitive dielectric films and interconnect metals in wafer/board-level fan-out packaging and wafer-level packaging, including test samples, test equipment, interface testing methods, test result analysis methods, and typical failure modes, etc.
Development Information
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