T/HNSEMCC 2-2025 Active Group standards

T/HNSEMCC 2-2025 System-in-Package (SiP) generic technical requirements

Publish Date: 2025-01-17 Implement Date: 2025-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 20.00

Out of stock

Basic Information

Standard Code: T/HNSEMCC 2-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components and information technology

ICS Name: Integrated circuits, microelectronics

Publish Date: 2025-01-17

Implement Date: 2025-02-01

Scope

Main technical content: This document specifies the general requirements, material requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for system-level packaging (SiP). This document is applicable to the design, production, inspection, and acceptance of packages such as chip flip-chip, lead bonding chips, and passive devices

Development Information

Related Standards

GB/T 4855-1984 Abolished

GB/T 4855-1984 Families and products of linear amplifier for semiconductor integrated circuits

Publish Date: 1984-12-18

GB/T 3434-1986 Abolished

GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits

Publish Date: 1986-04-02

GB/T 3431.2-1986 Active

GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins

Publish Date: 1986-07-01

GB/T 6648-1986 Active

GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories

Publish Date: 1986-07-31

GB/T 6800-1986 Abolished

GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits

Publish Date: 1986-08-28

GB/T 3435-1987 Abolished

GB/T 3435-1987 Series and products for semiconductor CMOS integrated circuits—Products of families 4000

Publish Date: 1987-01-21