GB/T 43536.1-2023 Active National standards

GB/T 43536.1-2023 Three dimensional integrated circuit—Part 1:Terminologies and definitions

GB/T 43536.1-2023 Three dimensional integrated circuit—Part 1:Terminologies and definitions

Publish Date: 2023-12-28 Implement Date: 2024-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 43536.1-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2023-12-28
Implement Date: 2024-04-01
Pages: 12 pages

Scope

This document defines the terms and definitions of multi-chip integrated circuits that implement stacked chips based on silicon through-silicon vias (TSVs) or bumps.
This document is applicable to the manufacturing and testing of multi-chip integrated circuits that implement stacked chips based on silicon through-silicon vias (TSVs) or bumps.

Development Information

Word Count: 25 Thousand words Pages: 12 pages

Same series standard

Adopt standards

IEC 63011-1:2018

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