GB/T 4855-1984
Abolished
GB/T 43536.2-2023
Active
National standards
GB/T 43536.2-2023 Three dimensional integrated circuits—Part 2:Alignment of stacked dies having fine pitch interconnect
GB/T 43536.2-2023 Three dimensional integrated circuits—Part 2:Alignment of stacked dies having fine pitch interconnect
Basic Information
Standard Code:
GB/T 43536.2-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Semiconductor integrated circuits
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2023-12-28
Implement Date:
2024-04-01
Pages:
12 pages
Scope
This document specifies the requirements for initial calibration and calibration maintenance between multiple stacked integrated circuits during the chip bonding process. It defines calibration marks and operational steps. This document is only applicable to inter-chip calibration using the electrical coupling method.
Development Information
Same series standard
Referenced Standards
IEC 63011-1
Adopt standards
IEC 63011-2:2018
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished