T/NLIA 003-2021 Active Group standards

T/NLIA 003-2021 Simulation Requirements for the Etching Process of Flexible PCB Encapsulation Substrates

T/NLIA 003-2021

Publish Date: 2021-04-26 Implement Date: 2021-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/NLIA 003-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic industry production equipment

ICS Name: Optoelectronics, laser equipment

Publish Date: 2021-04-26

Implement Date: 2021-06-01

Scope

Main technical content: This document specifies the general requirements for the simulation of the etching process of flexible PCB encapsulation substrates, the basic process, and the detailed requirements for the formulation of the simulation scheme, the construction of the simulation model, the analysis of the simulation results, and the evaluation and optimization of the results. This document is applicable to the application verification, structural development, and parameter optimization related to the etching process simulation of flexible PCB encapsulation substrates in the manufacturing process of related products