T/EDASQUARE 003.2-2024 Electronic Design Automation Tool Terminology - Part 2: Process, Manufacturing, and Packaging
T/EDASQUARE 003.2-2024 Electronic Design Automation Tool Terminology - Part 2: Process, Manufacturing, and Packaging
Basic Information
Scope
Main technical content: The "Terminology of Electronic Design Automation Tools" consists of two parts: — Part 1: Integrated Circuit Design. — Part 2: Process, Manufacturing, and Packaging. This document is Part 2 of the "Terminology of Electronic Design Automation Tools", which includes common terminology and frequently used technical terms for process, manufacturing, and packaging tools. In the process field, it includes terms such as device simulation, device models, microwave and millimeter wave device models, and process design kits; in the manufacturing field, it includes terms such as CMOS process models and simulations, compound process models and simulations, yield and defect analysis, computational lithography, and mask manufacturing; and in the packaging field, it includes terms such as traditional packaging and three-dimensional hermetic packaging, as well as commonly used terms in EDA tools.