T/ICMTIA PC0017-2022 Active Group standards

T/ICMTIA PC0017-2022 Solder silver plating solution for integrated circuits

Publish Date: 2022-05-10 Implement Date: 2022-05-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/ICMTIA PC0017-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Terminology (principles and coordination and cooperation)

Publish Date: 2022-05-10

Implement Date: 2022-05-31

Scope

Main technical content: This document specifies the technical requirements, testing methods, packaging and transportation, and safety requirements for tin-silver electroplating solutions used in integrated circuits. This document is applicable to tin-silver electroplating solutions used in integrated circuits. Tin-silver electroplating solutions for integrated circuits are mainly used in the advanced packaging process of the semiconductor industry and the electroplating process of tin or tin alloy columns