GB/T 35010.5-2018 Active National standards

GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation

GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation

Publish Date: 2018-03-15 Implement Date: 2018-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 35010.5-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2018-03-15
Implement Date: 2018-08-01
Pages: 9 pages

Scope

This part of GB/T 35010 is used to guide the production, supply, and use of semiconductor chip products, which include: ● wafers; ● individual bare chips; ● chips and wafers with interconnection structures; ● minimally or partially packaged chips and wafers. This part specifies the required electrical simulation information, with the aim of promoting the use of electronic data, electronic system electrical behavior, and functional verification simulation models. Electronic systems include semiconductor bare chips with or without interconnection structures, and/or minimally packaged semiconductor chips. This part is designed to ensure that all links in the chip product supply chain meet the requirements of IEC 622581 and IEC 622582.

Development Information

Word Count: 16 Thousand words Pages: 9 pages

Same series standard

Referenced Standards

IEC 62258-1 IEC 62258-2

Adopt standards

IEC 62258-5:2006

Related Standards

Contact Us