GB/T 35010.7-2018 Active National standards

GB/T 35010.7-2018 Semiconductor die products—Part 7:XML schema for data exchange

GB/T 35010.7-2018 Semiconductor die products—Part 7:XML schema for data exchange

Publish Date: 2018-03-15 Implement Date: 2018-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 35010.7-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2018-03-15
Implement Date: 2018-08-01
Pages: 32 pages

Scope

This part of GB/T 35010 is used to guide the production, supply, and use of semiconductor chip products. Semiconductor chip products include: -- wafers; -- individual bare chips; -- chips and wafers with interconnect structures; -- minimally or partially packaged chips and wafers. This part specifies an XML format that defines the elements required for data exchange, meets the implementation requirements of IEC 622581, IEC 622585, and IEC 622586, and supplements the exchange structure defined in IEC 622582. This part also supplements and is compatible with the questionnaires in IEC/TR 622584.

Development Information

Word Count: 62 Thousand words Pages: 32 pages

Same series standard

Referenced Standards

IEC 60050(所有部分) IEC 62258-1 IEC 62258-2 IEC/TR 62258-4 IEC 62258-5 IEC 62258-6

Adopt standards

IEC/TR 62258-7:2007

Related Standards

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