GB/T 35010.8-2018 Active National standards

GB/T 35010.8-2018 Semiconductor die products—Part 8:EXPRESS model schema for data exchange

GB/T 35010.8-2018 Semiconductor die products—Part 8:EXPRESS model schema for data exchange

Publish Date: 2018-03-15 Implement Date: 2018-08-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 35010.8-2018
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2018-03-15
Implement Date: 2018-08-01
Pages: 26 pages

Scope

This part of GB/T 35010 is used to guide the production, supply, and use of semiconductor chip products. Semiconductor chip products include: ● wafers; ● individual bare chips; ● chips and wafers with interconnection structures; ● minimally or partially packaged chips and wafers. This part specifies the EXPRESS format of the elements required for data exchange; meets the implementation requirements of IEC 622581, IEC 622585, and IEC 622586; supplements the data exchange structure defined in IEC 622582; and is compatible with and supplements the information tables in IEC 622584.

Development Information

Word Count: 50 Thousand words Pages: 26 pages

Same series standard

Referenced Standards

Adopt standards

IEC/TR 62258-8:2008

Related Standards

Contact Us