DZ/T 0101.12-1994
Active
SJ 21450-2018
Active
Industry standards-Electronics
SJ 21450-2018 Integrated circuit ceramic package-Technical requirement for wafer-thinning process
SJ 21450-2018 Integrated circuit ceramic package-Technical requirement for wafer-thinning process
Price:
$ 30
Basic Information
Standard Code:
SJ 21450-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
10 pages
Scope
This standard specifies the general requirements for the thinning process of integrated circuit wafers (hereinafter referred to as the thinning process) and the detailed requirements for the raw materials, equipment, process flow, key control points, and inspections involved in the thinning process. This standard applies to the thinning process of integrated circuit wafers with a size of 12 inches or less (excluding wafers with bumps).
Development Information
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