GB/T 4298-1984
Abolished
GB/T 44517-2024
Active
National standards
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
Price:
$ 54
Basic Information
Standard Code:
GB/T 44517-2024
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Micro-components
ICS Name:
Other discrete semiconductor devices
Publish Date:
2024-09-29
Implement Date:
2025-04-01
Pages:
16 pages
Scope
This document describes a method for measuring the residual stress of MEMS membranes with a thickness range of 0.01 μm to 10 μm, including the wafer curvature method and the cantilever deflection method.
This document is applicable to membranes deposited on substrates with known mechanical properties such as Young's modulus and Poisson's ratio.
Development Information
Referenced Standards
IEC 62047-21
Adopt standards
IEC 62047-16:2015
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