GB/T 44513-2024 Micro-electromechanical systems(MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application

Scope

This document describes the test methods for evaluating the durability of MEMS piezoelectric thin film materials under environmental stress (temperature and humidity), mechanical stress, and strain, as well as the test conditions used for quality assessment. This document specifically describes the test methods and conditions for measuring the durability of the tested devices under temperature and humidity conditions and applied voltage. This document is applicable to evaluating the durability and quality of MEMS piezoelectric thin film materials, as well as evaluating the positive piezoelectric properties of piezoelectric thin films formed on silicon substrates, such as those used as acoustic sensors or cantilever sensors. This document does not include reliability assessments, such as methods for predicting the lifespan of piezoelectric thin films based on the Weibull distribution.

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