T/CSTM 001470-2025 Active Group standards

T/CSTM 001470-2025 glass substrate for chip packaging

T/CSTM 001470-2025

Publish Date: 2025-05-14 Implement Date: 2025-08-14 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 20.00

Out of stock

Basic Information

Standard Code: T/CSTM 001470-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Building materials

ICS Name: \nGlass products

Publish Date: 2025-05-14

Implement Date: 2025-08-14

Scope

Scope: This document specifies the terms and definitions, specifications, requirements, test methods, inspection rules, packaging, marking, transportation, and storage of glass substrates for chip packaging. This document applies to glass substrates for chip packaging, including non-through-hole glass substrates, through-hole glass substrates, and through-hole copper-clad glass substrates. Main technical content: This document specifies the terms and definitions, specifications, requirements, test methods, inspection rules, packaging, marking, transportation, and storage of glass substrates for chip packaging. This document applies to glass substrates for chip packaging, including non-through-hole glass substrates, through-hole glass substrates, and through-hole copper-clad glass substrates.