T/SZMES 3-2021 Thickness stress measurement using bending method
T/SZMES 3-2021 Thickness stress measurement using bending method
Basic Information
Scope
Scope: This document specifies the terms and definitions, measurement principles, measurement instruments, sample requirements, measurement conditions, parameter determination, measurement, film stress calculation, and test reports for film stress measurement based on the substrate bending method. This document is applicable to film stress measurement based on the substrate bending method; Main technical content: This document specifies the terms and definitions for film stress measurement based on the substrate bending method, including: substrate, film, sample, thickness, coating, physical vapor deposition technology, and radius of curvature. Measurement principles: Measure the radius of curvature of the substrate before and after single-sided coating, the initial radius of curvature of the substrate, and the radius of curvature of the substrate (coated surface). Using the Stoney formula, the film stress is calculated.