T/WXICS 001-2024 Semiconductor chip packaging conductive adhesive performance requirements and testing methods

Scope

Scope: This document specifies the performance requirements and test methods for conductive adhesives used in the packaging of semiconductor chips (hereinafter referred to as "conductive adhesives"). It is applicable to the testing and acceptance of conductive adhesives used in the packaging of semiconductor chips, which are added with silver as conductive filler particles in organic polymers. Main technical content: This document specifies the performance and test requirements for conductive adhesives used in the packaging of semiconductor chips, mainly including: performance and test requirements before curing, during curing, after curing, and during the shelf life. Specifically, it includes: appearance inspection, viscosity, thixotropy index, non-volatile matter, curing time and temperature, glass transition temperature (Tg), tensile modulus, weight loss rate, shear strength, volume resistivity, thermal conductivity, thermal expansion coefficient, ion content, water absorption rate under high temperature and high humidity, and performance requirements and test methods for shelf life.

Development Information

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