T/WLJC 57-2019 Precision polishing disk for chips

Scope

Scope: This standard specifies the specifications, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of precision grinding discs for wafers. This standard applies to precision grinding discs for grinding wafers. Main technical content: The term "wafer" in the standard name includes: — Semiconductor material wafers, such as: single-crystal silicon Si, single-crystal germanium Ge, etc. — Composite semiconductor material wafers, such as: GaAs, GaN, InP, etc. — Photoelectric material wafers, such as: LiNbO3, BBO, etc. — Superhard material wafers, such as sapphire Sapphire, silicon carbide SiC, etc. The term "precision grinding disc" in the standard name distinguishes it from "coarse grinding discs". The standard provides 12 specifications and models of wafer grinding discs, including the main specifications and models of domestic wafer grinding discs. The key technical indicators of precision grinding discs are flatness and parallelism. The standard gives flatness and parallelism requirements for each specification of grinding discs, and the specified indicators represent the domestic first-class and international advanced level.

Development Information

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