GB/T 15877-2013 Active National standards

GB/T 15877-2013 Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

GB/T 15877-2013 Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

Publish Date: 2013-12-31 Implement Date: 2014-08-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 15877-2013
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor integrated circuits
ICS Name: Integrated circuits, microelectronics
Publish Date: 2013-12-31
Implement Date: 2014-08-15
Pages: 10 pages

Scope

This standard specifies the technical requirements, test methods, and inspection rules for etched dual-in-line package lead frames (hereinafter referred to as lead frames) of semiconductor integrated circuits.
This standard applies to etched dual-in-line (DIP) package lead frames (gold-plated and silver-plated) of semiconductor integrated circuits. Single-in-line etched lead frames can also be used as a reference for application.

Development Information

Word Count: 18 Thousand words Pages: 10 pages

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