GB/T 8750-2022 Active National standards

GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package

GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package

Publish Date: 2022-12-30 Implement Date: 2023-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 8750-2022
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Precious metals and their alloys
ICS Name: Other non-ferrous metal products
Publish Date: 2022-12-30
Implement Date: 2023-07-01
Publisher: 国家市场监督管理总局、国家标准化管理委员会
Technical Committee: 全国有色金属标准化技术委员会(SAC/TC 243)
Pages: 31 pages

Scope

本文件规定了半导体封装用金基键合丝、带的分类和标记、技术要求、试验方法、检验规则、标志、包装、运输、贮存及随行文件和订货单(或合同)内容。本文件适用于半导体分立器件和集成电路封装用金基键合丝、带。

Development Information

Drafting Units:

北京达博有色金属焊料有限责任公司、北京有色金属与稀土应用研究所有限公司、浙江佳博科技股份有限公司、贵研铂业股份有限公司、上杭县紫金佳博电子新材料科技有限公司

Drafting Persons:

闫茹、田柳、张京叶、薛子夜、周文艳、刘洁、黄晓猛、赵义东、康菲菲、张虎、元琳琳、裴洪营、向翠华、陈雪平、谢海涛、周钢

Word Count: 62 Thousand words Pages: 31 pages

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