GB/T 8750-2022 Active National standards

GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package

GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package

Publish Date: 2022-12-30 Implement Date: 2023-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 8750-2022
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Precious metals and their alloys
ICS Name: Other non-ferrous metal products
Publish Date: 2022-12-30
Implement Date: 2023-07-01
Pages: 31 pages

Scope

This document specifies the classification and marking of gold-based bonding wires and tapes used in semiconductor packaging, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and the contents of accompanying documents and purchase orders (or contracts). This document applies to gold-based bonding wires and tapes used in the packaging of semiconductor discrete devices and integrated circuits.

Development Information

Word Count: 62 Thousand words Pages: 31 pages

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