T/UNP 733-2025 Active Group standards

T/UNP 733-2025 Test Method for Semiconductor Thermoelectric Cooling Devices (TECs)

T/UNP 733-2025

Publish Date: 2025-06-18 Implement Date: 2025-06-18 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/UNP 733-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2025-06-18

Implement Date: 2025-06-18

Scope

Main technical content: This standard covers multiple reliability tests for semiconductor thermoelectric cooling (TEC) devices. It includes the wire tension test, which requires applying static loads in different directions and checking the lead wires; the high-temperature storage test, which is conducted at a specific temperature for a certain period and involves testing the internal resistance change; the constant temperature and humidity test, which is carried out in a constant temperature and humidity environment; as well as the electro-cooling and heating alternating test, pressure resistance test, mechanical vibration test, etc. Each test has corresponding requirements for equipment, environment, sample preparation, procedures, and result evaluation, which is applicable to the reliability test of the devices to ensure their stable performance under various conditions.