T/SZBX 018-2021 Active Group standards

T/SZBX 018-2021 Wafer-level Chip Scale Package (CSP) products

T/SZBX 018-2021 Wafer-level Chip Scale Package (CSP) products

Publish Date: 2021-01-22 Implement Date: 2021-01-27 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/SZBX 018-2021
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2021-01-22
Implement Date: 2021-01-27

Scope

Scope: This document applies to finished devices with wafer-level chip size packaging; Main technical content: This document specifies the structure code, symbol abbreviations, and product outline diagrams of wafer-level chip size packaging products, as well as technical requirements, testing methods, inspection rules, labels, markings, packaging, transportation, and storage, etc.

Development Information

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