T/ZOIA 30001-2022 Active Group standards

T/ZOIA 30001-2022 MEMS high aspect ratio structure depth measurement method: Spectral reflection method

Publish Date: 2022-12-29 Implement Date: 2022-12-29 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/ZOIA 30001-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components and information technology

ICS Name: Optoelectronics, laser equipment

Publish Date: 2022-12-29

Implement Date: 2022-12-29

Scope

Main technical content: This standard specifies the measurement principles, measurement equipment, measurement requirements, measurement methods, uncertainty evaluation of measurement results, synthetic relative uncertainty evaluation, extended relative uncertainty evaluation, and test reports for the depth measurement of MEMS high aspect ratio etched structures on various semiconductor materials. This standard is applicable to the depth measurement of MEMS high aspect ratio etched structures on various semiconductor materials. Etched structures include but are not limited to trenches, pillars, and holes of single bodies and arrays, etc.