SJ 21327-2018 Active Industry standards-Electronics

SJ 21327-2018 Ceramic packages Technical requirements for assembling process of surface-mounted type

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: SJ 21327-2018

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 2018-01-18

Implement Date: 2018-05-01

Pages: 13 pages

Scope

This standard specifies the general and detailed requirements for the assembly process of mounted ceramic housings used in microelectronics packaging. This standard applies to the assembly process of mounted high-temperature co-fired multilayer ceramic housings used in microelectronics packaging.

Development Information

Pages: 13 pages

Referenced Standards

GB/T 25915.1-2010 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness

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