YS/T 837-2012 Active
YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
Abstract
This standard specifies the general requirements, testing equipment, comparison test pieces, testing process, defect evaluation, and testing reports for the bonding quality inspection of sputtering target backplanes. The method uses ultrasonic longitudinal wave pulse reflection immersion C-scan inspection technology.
This standard is applicable to the inspection of defects such as holes, non-bonding, and oxide inclusions in the bonding surfaces of sputtering target backplanes using intermediate layer materials (such as soft soldering, hard soldering, and epoxy resin bonding). The non-destructive testing of bonding quality of materials for other purposes can also be used for reference.
General Product Information
| Document Type | Industry standards-Non-ferrous metals |
|---|---|
| Standard Status | Active |
| Standard Code | YS/T 837-2012 |
| CCS | Precious metals and their alloys |
| ICS | Other non-ferrous metals and their alloys |
| Implement Date | 2013-03-01 |