GB/T 12965-2018 Active
GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
Abstract
This standard specifies the grades and classification, requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality certificates, and order forms (or contracts) of silicon single-crystal cutting wafers and polishing wafers (referred to as silicon wafers). This standard applies to circular silicon single-crystal cutting wafers and polishing wafers with a diameter of no more than 200 mm, prepared by the direct-pulling method and the floating zone melting method (including neutron transmutation doping and gas phase doping). The products are mainly used for manufacturing transistors, rectifier devices, etc., or further processed into polished wafers.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 12965-2018 |
| CCS | Element semiconductor materials |
| ICS | Semiconductor materials |
| Implement Date | 2019-06-01 |