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GB/T 29507-2013 Active
GB/T 29507-2013 Test method for measuring flatness,thickness and total thickness variation on silicon wafers—Automated non-contact scanning
Abstract
This standard specifies the testing of the flatness, thickness, and total thickness variation of silicon wafers with a diameter of not less than 50 mm and a thickness of not less than 100 μm, which have undergone cutting, grinding, etching, polishing, epitaxy, or other surface treatments.
This standard is a non-destructive, contactless automatic scanning testing method, suitable for the flatness and thickness testing of clean, dry silicon wafers, and is not affected by changes in the thickness of the silicon wafers, their surface conditions, or their shapes.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 29507-2013 |
| CCS | Semi-metals and semiconductor materials |
| ICS | Semiconductor materials |
| Implement Date | 2014-02-01 |
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