GB/T 29507-2013 Active National standards

GB/T 29507-2013 Test method for measuring flatness,thickness and total thickness variation on silicon wafers—Automated non-contact scanning

Publish Date: 2013-05-09 Implement Date: 2014-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 29507-2013

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semi-metals and semiconductor materials

ICS Name: Semiconductor materials

Publish Date: 2013-05-09

Implement Date: 2014-02-01

Pages: 13 pages

Scope

This standard specifies the testing of the flatness, thickness, and total thickness variation of silicon wafers with a diameter of not less than 50 mm and a thickness of not less than 100 μm, which have undergone cutting, grinding, etching, polishing, epitaxy, or other surface treatments.
This standard is a non-destructive, contactless automatic scanning testing method, suitable for the flatness and thickness testing of clean, dry silicon wafers, and is not affected by changes in the thickness of the silicon wafers, their surface conditions, or their shapes.