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GB/T 8750-2014
GB/T 8750-2014 Gold bonding wire for semiconductor package
Abstract
This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation and storage, quality certificates, contracts (or purchase orders), etc. for bonding wires used in the packaging of semiconductor discrete devices, integrated circuits, and LEDs.
This standard applies to bonding wires used in semiconductor packaging.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Replaced |
| Standard Code | GB/T 8750-2014 |
| CCS | Precious metals and their alloys |
| ICS | Other non-ferrous metal products |
| Implement Date | 2015-02-01 |
Price
$ 74
Subtotal
$ 74
Tax
$ 0.00
Order Total (incl. tax)
$ 74