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T/JSSIA 0001-2024 Active
T/JSSIA 0001-2024 Evaluation method for interface bonding force between photoconductive medium thin film and interconnect metal interface
Abstract
Scope: Applicable to wafer/board-level fan-out packaging, the evaluation of the bonding strength between photosensitive dielectric films and interconnect metals in wafer-level packaging, and the interface between photosensitive films and film materials; Main technical content: This document specifies the test methods for the bonding strength between photosensitive dielectric films and interconnect metals in wafer/board-level fan-out packaging and wafer-level packaging, including test samples, test equipment, interface testing methods, test result analysis methods, and typical failure modes, etc.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/JSSIA 0001-2024 |
| CCS | Microcircuit |
| ICS | Integrated circuits, microelectronics |
| Implement Date | 2024-06-10 |
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