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GB/T 35005-2018 Active
GB/T 35005-2018 Test methods for flip chip integrated circuits
Abstract
This standard specifies the physical testing methods related to bump coplanarity, bump shear force, chip shear pullout force, solder joint defects, and underfill defects in the flip-chip integrated circuit packaging process. This standard is applicable to flip-chip single-chip integrated circuits packaged in ceramic or plastic packages.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 35005-2018 |
| CCS | Microcircuit |
| ICS | Integrated circuits, microelectronics |
| Implement Date | 2018-08-01 |
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$ 66
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$ 66
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$ 66