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GB/T 26067-2010 Active
GB/T 26067-2010 Standard test method for dimensions of notches on silicon wafers
Abstract
1.1 This standard qualitatively provides a non-destructive testing method for determining whether the reference incisions of silicon wafers meet the standard limit requirements. The testing principle of this method is also applicable to the measurement of incisions of other sizes.
1.2 In this standard, when the object plane size is 0.1mm, it will form a 2.0mm image on the projection screen after 20 times magnification, and a 5.0mm image after 50 times magnification. This method can detect the smallest size details on the incision contour.
1.3 This standard does not provide a test for the radius of curvature at the top of the incision.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 26067-2010 |
| CCS | Analysis methods for semi-metallic and semiconductor materials |
| ICS | Semiconductor materials |
| Implement Date | 2011-10-01 |
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