GB/Z 41275.22-2023 Active
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
Abstract
This document provides a technical guide for the transition to lead-free electronic products, mainly covering technical pathways, the general performance of lead-free solder, system-level usage environments, high-performance electronic product testing, solder joint reliability, components, printed circuit boards (PCBs), printed wiring boards (PWBs), module assembly, wire/cable assembly, rework/repair, general product life testing, and similarity analysis. This document is applicable to fields such as aerospace, defense, and high-performance electronic applications, and can also be used as a reference by other high-performance and high-reliability industries.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/Z 41275.22-2023 |
| CCS | Electronic components |
| ICS | Comprehensive materials for aerospace manufacturing |
| Implement Date | 2024-07-01 |