GB/T 41215-2021
Active
GB/Z 41275.22-2023
Active
National standards
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
Basic Information
Standard Code:
GB/Z 41275.22-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Comprehensive materials for aerospace manufacturing
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国航空电子过程管理标准化技术委员会(SAC/TC 427)
Pages:
58 pages
Scope
本文件提供了向无铅电子产品过渡的技术指南，主要包含技术路径、无铅焊料的一般性能、系统级使用环境、高性能电子产品试验、焊点可靠性、部件、印制电路板、印制电路板（PCB)/印制线路板（PWB)组装件、模块装配、导线/电缆装配、返工/修复、通用产品寿命试验、相似性分析等内容。本文件适用于航空航天、国防和高性能电子应用等领域，其他高性能和高可靠性行业参考使用。
Development Information
Drafting Units:
中国航空工业集团公司雷华电子技术研究所、中国航空综合技术研究所、中国航空工业集团公司洛阳电光设备研究所、国营芜湖机械厂、太原航空仪表有限公司、广州汉源微电子封装材料有限公司
Drafting Persons:
赵丙款、张晓蕾、任海涛、刘站平、王洁、王金泉、孙科、庞景玉、吕冰、杜文杰、范鑫、刘良勇、任烨、段玉思、李巍、宁江天
Same series standard
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Referenced Standards
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
IEC/TS 62647-1:2012
GEIA-HB-0005-4
IPC/JEDEC JP002
IPC-9701
Adopt standards
IEC/TS 62647-22:2013
Related Standards
GB/T 41275.21-2022
Active
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21:Guidelines for transition to lead-free electronics
GB/T 41275.2-2022
Active
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022
Active
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41886-2022
Active
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft
GB/T 42846-2023
Active