GB/T 41215-2021
Active
GB/Z 41275.22-2023
Active
National standards
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22:Technical guidelines
Price:
$ 168
Basic Information
Standard Code:
GB/Z 41275.22-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic components
ICS Name:
Comprehensive materials for aerospace manufacturing
Publish Date:
2023-12-28
Implement Date:
2024-07-01
Pages:
58 pages
Scope
This document provides a technical guide for the transition to lead-free electronic products, mainly covering technical pathways, the general performance of lead-free solder, system-level usage environments, high-performance electronic product testing, solder joint reliability, components, printed circuit boards (PCBs), printed wiring boards (PWBs), module assembly, wire/cable assembly, rework/repair, general product life testing, and similarity analysis. This document is applicable to fields such as aerospace, defense, and high-performance electronic applications, and can also be used as a reference by other high-performance and high-reliability industries.
Development Information
Same series standard
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array(BGA) re-balling
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23:Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
Referenced Standards
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
IEC/TS 62647-1:2012
GEIA-HB-0005-4
IPC/JEDEC JP002
IPC-9701
Adopt standards
IEC/TS 62647-22:2013
Related Standards
GB/T 41275.21-2022
Active
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21:Guidelines for transition to lead-free electronics
GB/T 41275.2-2022
Active
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin
GB/T 41275.3-2022
Active
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41886-2022
Active
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft
GB/T 42846-2023
Active