GB/T 4298-1984
Abolished
GB/T 44514-2024
Active
National standards
GB/T 44514-2024 Micro-electromechanical system(MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
GB/T 44514-2024 Micro-electromechanical system(MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Price:
$ 54
Basic Information
Standard Code:
GB/T 44514-2024
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Micro-components
ICS Name:
Other discrete semiconductor devices
Publish Date:
2024-09-29
Implement Date:
2024-09-29
Pages:
16 pages
Scope
This document describes a four-point bending measurement method based on the concept of fracture mechanics. It uses the pure bending moment acting on layered MEMS materials to measure the interfacial adhesion energy using the critical bending moment at which the weakest interface undergoes steady-state cracking.
This document is applicable to MEMS devices with thin film layers deposited on a semiconductor substrate. The total thickness of the thin film layer should be less than 1/100 of the thickness of the supporting substrate (usually a silicon wafer).
Development Information
Adopt standards
IEC 62047-31:2019
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