GB/T 5130-1997
Replaced
T/ICMTIA PM0010-2022
Active
T/ICMTIA PM0010-2022 Epoxy mold compound for integrated circuits
T/ICMTIA PM0010-2022 Epoxy mold compound for integrated circuits
Price:
$ 43.00
Basic Information
Standard Code:
T/ICMTIA PM0010-2022
Standard Type:
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electrician's insulating materials and their products
ICS Name:
Plastic and rubber insulation materials
Publish Date:
1970-01-01
Implement Date:
1970-01-01
Scope
Main technical content: This document specifies the technical requirements, testing methods, inspection rules, marking, packaging, transportation, and storage requirements for epoxy molding compounds used in integrated circuits. This document is applicable to epoxy molding compounds used in integrated circuits.
Development Information
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GB/T 7113-2003
Replaced
GB/T 7113-2003 Flexible insulating sleeving—Definitions and general requirements
GB 12802.2-2004
Replaced
GB 12802.2-2004 Film for electrical insulation—Part 2:Polythylene terephthalate film used for eletrical insulation
GB/T 20875.1-2007
Active
GB/T 20875.1-2007 Method of test for the hydrolytic stability of electrical insulating materials—Part 1:Plastic films
GB/T 23641-2009
Replaced