T/ICMTIA PM0010-2022 Active

T/ICMTIA PM0010-2022 Epoxy mold compound for integrated circuits

T/ICMTIA PM0010-2022 Epoxy mold compound for integrated circuits

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/ICMTIA PM0010-2022
Standard Type:
Standard Status: Active
is_force_gb: no
CCS Name: Electrician's insulating materials and their products
ICS Name: Plastic and rubber insulation materials
Publish Date: 1970-01-01
Implement Date: 1970-01-01

Scope

Main technical content: This document specifies the technical requirements, testing methods, inspection rules, marking, packaging, transportation, and storage requirements for epoxy molding compounds used in integrated circuits. This document is applicable to epoxy molding compounds used in integrated circuits.

Development Information

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