T/EDASQUARE 003.2-2024 Active Group standards

T/EDASQUARE 003.2-2024 Electronic Design Automation Tool Terminology - Part 2: Process, Manufacturing, and Packaging

Publish Date: 2024-09-21 Implement Date: 2024-09-22 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/EDASQUARE 003.2-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Integrated circuits, microelectronics

Publish Date: 2024-09-21

Implement Date: 2024-09-22

Scope

Main technical content: The "Terminology of Electronic Design Automation Tools" consists of two parts: — Part 1: Integrated Circuit Design. — Part 2: Process, Manufacturing, and Packaging. This document is Part 2 of the "Terminology of Electronic Design Automation Tools", which includes common terminology and frequently used technical terms for process, manufacturing, and packaging tools. In the process field, it includes terms such as device simulation, device models, microwave and millimeter wave device models, and process design kits; in the manufacturing field, it includes terms such as CMOS process models and simulations, compound process models and simulations, yield and defect analysis, computational lithography, and mask manufacturing; and in the packaging field, it includes terms such as traditional packaging and three-dimensional hermetic packaging, as well as commonly used terms in EDA tools.

Development Information

Related Standards

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