T/CI 512-2024 Active Group standards

T/CI 512-2024 Silicon-based thick metal film electroplating process technology specification

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CI 512-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 1970-01-01

Implement Date: 1970-01-01

Scope

This document specifies the processing capabilities, safeguard conditions, materials, safety and environmental operations, inspection, and other technical requirements of the silicon-based thick metal plating process, and establishes the process procedures for the silicon-based thick metal plating process. This document is applicable to the electroplating processing of multi-layer wiring of thick metal films in silicon-based MEMS manufacturing technology.

Development Information

Word Count: 25 Thousand words

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