T/CWAN 0031-2021 Active Group standards

T/CWAN 0031-2021 Soft brazing paste test method

T/CWAN 0031-2021 Soft brazing paste test method

Publish Date: 2021-12-29 Implement Date: 2022-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CWAN 0031-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Welding and cutting

ICS Name: \nBrazing and low-temperature welding

Publish Date: 2021-12-29

Implement Date: 2022-02-01

Pages: 24 pages

Scope

This document specifies the test methods for solder paste (hereinafter referred to as "solder paste"), including the chemical composition of the alloy, the shape, size, and distribution of the alloy powder, the content of the alloy powder and flux, the stability of the solder paste, viscosity, adhesion, collapse test, tin ball test, wettability, spreading rate, copper corrosion test, copper mirror test, surface insulation resistance, electrochemical migration test, storage life test, and dryness (adhesiveness).
This document is applicable to solder paste used for welding electronic products.

Development Information

Word Count: 44 Thousand words Pages: 24 pages

Referenced Standards

GB/T 678-2002 Chemical reagent—Ethanol GB/T 678-2023 Chemical reagent—Ethanol GB/T 686-1989 Chemical reagent—Acetone GB/T 686-2008 Chemical reagent—Acetone GB/T 686-2023 Chemical reagent—Acetone GB/T 687-1994 Chemical reagent—Glycerol GB/T 687-2011 Chemical reagent—Glycerol GB/T 1480-1995 Determination of particle size for metallic powders—Dry sieving GB/T 1480-2012 Metallic powders—Determination of particle size by dry sieving GB/T 1480-2025 Metallic powders—Determination of particle size by dry sieving GB/T 2040-2002 Sheet of copper and copper alloy GB/T 2040-2008 Sheet of copper and copper alloy GB/T 2040-2017 Copper and copper alloy sheet GB/T 3131-2001 Tin-lead solder GB/T 3131-2020 Tin-lead solder GB/T 8145-2003 Gum rosin GB/T 8145-2021 Gum rosin GB/T 11363-1989 Methods of the strength tests for brazed and soldered joint GB/T 11363-2008 Test method of the strength for brazed and soldered joint GB/T 11364-1989 Test method of spread-ability and clearance filling ability for filler metal GB/T 11364-2008 Test method of wettability for brazing filler metals GB/T 19077-2016 Particle size analysis—Laser diffraction methods GB/T 19077-2024 Particle size analysis—Laser diffraction methods GB/T 19077.1-2003 Particle size analysis—Laser diffraction method GB/T 19077.1-2008 Particle size analysis—Laser diffraction methods—Part 1:General principles GB/T 20422-2006 Lead-free solders GB/T 20422-2018 Lead-free solders GB/T 33148-2016 Soldering and brazing terms GB/T 38265.14-2021 Test methods for soft soldering fluxes—Part 14:Assessment of tackiness of flux residues GB/T 38265.15-2021 Test methods for soft soldering fluxes—Part 15: Copper corrosion test GB/T 38265.17-2022 Test methods for soft soldering fluxes—Part 17:Surface insulation resistance comb test and electrochemical migration test of flux residues HG/T 2892-2020 HG/T 2892-2020 Chemical reagent isopropanol HG/T 2892-2010 chemistry reagents, isopropyl alcohol HG/T 2892-1997 HG/T 2892-1997 Chemical reagent Isopropyl alcohol T/CWAN 0032-2021 Soft soldering paste classification and performance requirements

Related Standards

GB/T 6418-1993 Replaced

GB/T 6418-1993 Copper base brazing filler metals

Publish Date: 1993-06-10

GB/T 10046-2000 Replaced

GB/T 10046-2000 Silver filler metals for brazing

Publish Date: 2000-03-16

GB/T 8012-2000 Replaced

GB/T 8012-2000 Casting tin-lead solders

Publish Date: 2000-06-09

GB/T 3131-2001 Replaced

GB/T 3131-2001 Tin-lead solder

Publish Date: 2001-05-29

GB/T 19418-2003 Active

GB/T 19418-2003 Arc-welded joints in steel—Guidance on quality levels for imperfections

Publish Date: 2003-11-28

GB/T 20422-2006 Replaced

GB/T 20422-2006 Lead-free solders

Publish Date: 2006-08-22