GB/T 42576-2023
现行
T/CMIF 137-2021
现行
团体标准
T/CMIF 137-2021 半导体封装键合用银金合金丝
T/CMIF 137-2021 Silver-gold alloy wire for semiconductor packaging bonding
价格:
$ 20.00
基本信息
标准编号:
T/CMIF 137-2021
标准类型:
团体标准
标准状态:
现行
is_force_gb:
no
中国标准分类名称:
有色金属及其合金产品
国际标准分类名称:
电子元器件组件
发布日期:
2021-01-19
实施日期:
2021-03-01
归口单位:
中国机械工业联合会
适用范围
范围:本文件规定了半导体封装键合用银金合金丝的产品分类、技术要求、试验方法、检验规则、标志、包装、运输和贮存。 本文件适用于半导体封装键合用银金合金丝; 主要技术内容:前言 ···························································································································· III1 范围 ·························································································································· 12 规范性引用文件 ·········································································································· 13 术语和定义 ················································································································· 14 产品分类 ···················································································································· 14.1 产品代号 ··············································································································· 14.2 产品分类 ··············································································································· 15 技术要求 ·····································
研制信息
起草单位:
重庆材料研究院有限公司、河南科技大学、河南理工大学、重庆四联光电科技有限公司、重庆理工大学、河南优克电子材料有限公司
起草人:
宋克兴、吴保安、唐会毅、曹 军、何伦英、乜 辉、黄福祥、李 科、肖雨辰