T/CMIF 137-2021 Active Group standards

T/CMIF 137-2021 Silver-gold alloy wire for semiconductor packaging bonding

Publish Date: 2021-01-19 Implement Date: 2021-03-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CMIF 137-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Non-ferrous metals and their alloy products

ICS Name: Electronic components and assemblies

Publish Date: 2021-01-19

Implement Date: 2021-03-01

Scope

Scope: This document specifies the product classification, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of silver-gold alloy wires for semiconductor packaging bonding; This document applies to silver-gold alloy wires for semiconductor packaging bonding; Main technical content: Preface ···················································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································································